E-mail: byunghopaulcha AT gmail DOT com
Personal Page: http://sites.google.com/site/byunghopaulcha77
Curriculum Vitae

Byung-Ho (Paul) Cha received his B.S. degree (Summa Cum Laude) in Department of Electronic Engineering at Sogang University, Seoul, Korea, in 2004. He got his M.S. degree in 2006 and Ph.D. degree in 2009 in Signal and Image Processing Institute, Ming Hsieh Department of Electrical Engineering at Viterbi Schoold of Engineering, University of Southern California, LA, CA. He was a member of Media Communications Lab (MCL) advised by Prof. C.-C. Jay Kuo and worked with the Audio/Music Signal Processing (AMSP) subgroup. He is a senior engineer at Samsung Electronics DMC R&D in South Korea, currently. His research interests include multimedia security emphasis on watermarking, fingerprinting and steganography, forensic analysis, digital rights management (DRM), multimedia signal processing, multimedia quality assessment, multimedia communications, wireless communication and networking.

Research Descriptions:

• Byung-Ho Cha, C.-C. Jay Kuo , Design of Collusion-free Hiding Codes Using MAI-free Principle .
• Byung-Ho Cha, C.-C. Jay Kuo , Design of Multiuser Collusion-free Hiding Codes With Delayed Embedding .
• Byung-Ho Cha, C.-C. Jay Kuo , Advanced Colluder Detection Techniques for OSIFT-based Hiding Codes .
• Byung-Ho Cha, C.-C. Jay Kuo , Anti-collusion Fingerprinting With Scalar Costa Scheme (SCS) and Colluder Weight Recovery .
• Byung-Ho Cha, C.-C. Jay Kuo , Analysis of Time-Varying Collusion Attacks in Fingerprinting Systems: Capacity and Throughput .

Update profile